论文标题
通过保证金最大化，面向净分离的印刷电路板放置
Net Separation-Oriented Printed Circuit Board Placement via Margin Maximization
论文作者
论文摘要
由于摩尔的范式转移的范式越来越多，包装已成为一个至关重要的过程。解决制造业和收益率问题是现代布局算法的重大挑战。 我们建议将印刷电路板（PCB）放置作为包装问题的基准。设计了最大修订的公式，以改善网之间的分离。我们的框架包括种子布局提案，基于坐标的基于下降的程序以优化路由性，以及一种使布局合法化的混合智能线性编程方法。我们通过14个PCB设计和一个开源路由器进行了广泛的研究。我们表明，NS-place产生的位置提高路由线路长度高达25 \％，将VIA的数量减少高达50 \％，并将DRV的数量减少79 \％，而与手动和无线长度相比。
Packaging has become a crucial process due to the paradigm shift of More than Moore. Addressing manufacturing and yield issues is a significant challenge for modern layout algorithms. We propose to use printed circuit board (PCB) placement as a benchmark for the packaging problem. A maximum-margin formulation is devised to improve the separation between nets. Our framework includes seed layout proposals, a coordinate descent-based procedure to optimize routability, and a mixed-integer linear programming method to legalize the layout. We perform an extensive study with 14 PCB designs and an open-source router. We show that the placements produced by NS-place improve routed wirelength by up to 25\%, reduce the number of vias by up to 50\%, and reduce the number of DRVs by 79\% compared to manual and wirelength-minimal placements.
