论文标题

弹道热传输在少于10 nm激光诱导的gan晶体中的热点

Ballistic Thermal Transport at Sub-10 nm Laser-Induced Hot Spots in GaN Crystal

论文作者

Huang, Dezhao, Sun, Qiangsheng, Liu, Zeyu, Xu, Shen, Yang, Ronggui, Yue, Yanan

论文摘要

氮化炮(GAN)是典型的宽带半导体,在广泛的电子应用中起着至关重要的作用。纳米级热点处的弹道热传输将大大降低设备的特征长度达到纳米尺度的范围,这是由于散热耗散的。在这项工作中,我们开发了一种尖端增强的拉曼温度计方法,用于研究甘恩10 nm范围内的弹道热传输,同时实现激光加热并测量局部温度。拉曼的结果表明,以澳大利亚倾向的热点的温度升高,比裸露的尖端区域(20 k)高的温度高两倍(40 K)。为了进一步研究这种温度差的可能机制,我们进行了电磁模拟以产生高度聚焦的加热场,并观察到高度局部的光渗透范围在10 nm的范围内。因此,可以通过将数值仿真结果与实验测量的温度升高进行比较,可以确定GAN底物的声音平均自由路径(MFP),这与根据第一个原理模拟计算得出的平均MFP与模式特定的热导率加权的平均MFP相吻合。我们的结果表明,可以通过实验和模拟的组合迅速预测材料的声子MFP,这些材料可以在基于GAN的电子产品的热管理中找到广泛的应用。

Gallium nitride (GaN) is a typical wide-bandgap semiconductor with a critical role in a wide range of electronic applications. Ballistic thermal transport at nanoscale hotspots will greatly reduce the performance of a device when its characteristic length reaches the nanometer scale, due to heat dissipation. In this work, we developed a tip-enhanced Raman thermometry approach to study ballistic thermal transport within the range of 10 nm in GaN, simultaneously achieving laser heating and measuring the local temperature. The Raman results showed that the temperature increase from an Au-coated tip-focused hotspot was up to two times higher (40 K) than that in a bare tip-focused region (20 K). To further investigate the possible mechanisms behind this temperature difference, we performed electromagnetic simulations to generate a highly focused heating field, and observed a highly localized optical penetration, within a range of 10 nm. The phonon mean free path (MFP) of the GaN substrate could thus be determined by comparing the numerical simulation results with the experimentally measured temperature increase which was in good agreement with the average MFP weighted by the mode-specific thermal conductivity, as calculated from first-principles simulations. Our results demonstrate that the phonon MFP of a material can be rapidly predicted through a combination of experiments and simulations, which can find wide application in the thermal management of GaN-based electronics.

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