论文标题
高Q封装的微电谐振器的色散读数
Dispersive readout of a high-Q encapsulated micromechanical resonator
论文作者
论文摘要
Megahertz范围内的封装散装模式微孔子用于商业定时和传感应用程序，但其性能受到读取方法的当前状态的限制。我们在高Q封装的散装模式微机械谐振和集体元件微波谐振器之间使用分散耦合证明了读数，该谐振器是通过市售的组件和标准印刷电路板制造方法实现的，并在室温和压力下运行。微波读数系统的频域测量结果可产生$ 522 \，\ mathrm {fm/\ sqrt {hz}} $的位移分辨率，该分辨率证明了对散装模式包含的微孔子中排量测量的现状的改进。这种方法可以在低温测量中很容易实现，从而使未来的工作表征了在低温温度下封装的散装模式谐振器的热机械噪声。
Encapsulated bulk mode microresonators in the megahertz range are used in commercial timekeeping and sensing applications but their performance is limited by the current state of the art of readout methods. We demonstrate a readout using dispersive coupling between a high-Q encapsulated bulk mode micromechanical resonator and a lumped element microwave resonator that is implemented with commercially available components and standard printed circuit board fabrication methods and operates at room temperature and pressure. A frequency domain measurement of the microwave readout system yields a displacement resolution of $522 \, \mathrm{fm/\sqrt{Hz}}$, which demonstrates an improvement over the state of the art of displacement measurement in bulk-mode encapsulated microresonators. This approach can be readily implemented in cryogenic measurements, allowing for future work characterizing the thermomechanical noise of encapsulated bulk mode resonators at cryogenic temperatures.
