论文标题
具有控制直径和间距的周期性，柔性和多孔硅微线阵列的制造：对光学性质的影响
Fabrication of Periodic, Flexible and Porous Silicon Microwire Arrays with Controlled Diameter and Spacing: Effects on Optical properties
论文作者
论文摘要
一种新方法在制造尺寸和螺距控制的柔性硅微线（SIMWS）的纳米孔中以晶圆量表的形式提出，除了将金属催化的电气蚀刻蚀刻技术与氧化剂和介绍对固定剂的浓度不同，但使用纳米层光刻技术除了金属催化的电气蚀刻技术外。为了实现在晶圆尺度的简单旋涂过程中Sio2微粒的自组装单层封闭式图案。研究了蚀变，氧化剂和表面活性剂对SIMW的形态和光学特性的变化的影响。通过简单地控制SIO2微粒的直径和H2O2的浓度，可以在晶圆尺度中控制MW的大小以及引入孔。对于这些多孔，海绵状和柔性的SIMW阵列，平均反射率在400-800 nm的宽光谱范围内抑制至8％以下。还证明了Simws的海绵状，多孔和柔性性质的这种机制，以更好地理解蚀刻过程。
A new method of introducing nanopores with spongy morphology during fabrication of size and pitch controlled flexible silicon microwires (SiMWs) in wafer scale is presented using nanosphere lithography technique in addition to metal catalyzed electroless etching technique by varying concentration of oxidant and introducing surfactant or co-solvents to the etching solution. For achieving self-assembled monolayer closed-pack pattern of SiO2 microparticles in wafer-scale simple spin coating process was used. The effect of variation of the etchant, oxidant and surfactant on the morphology and optical properties of SiMWs were studied. By simply controlling the diameter of SiO2 microparticles and concentration of H2O2 the size of the MWs as well as the introduction of pores could be controlled in wafer-scale. Average reflectance suppressed to below 8% in the broad spectral range of 400-800 nm for these porous, spongy and flexible SiMW arrays in wafer scale. The mechanism behind this formation of spongy, porous and flexible nature of the SiMWs is also demonstrated for a better understanding of the etching process.
