论文标题
探测FESI,一种具有磁场,压力和微波的D-电子拓扑昆多绝缘子候选者
Probing FeSi, a d-electron topological Kondo insulator candidate, with magnetic field, pressure, and microwaves
论文作者
论文摘要
最近,报告了相关的D-电子小间隙半导体FESI的表面状态以下的表面状态的证据。在本文报道的工作中,通过电阻率测量值探测了导电表面状态和FESI的大相位,这是温度t,磁场B至60 t和压力P至7.6 GPA的函数,并通过磁场调制微波光谱(MFMMS)技术。还将FESI的性质与近托绝缘子SMB6的性质进行了比较,以解决FESI是否是F-电子杂种绝缘子的D-电子类似物,此外,还有拓扑性掩体绝缘体。 FESI的磁倍率MR在高于和低于发作温度(T_S)19 K的温度下的总体行为与SMB6的总体行为相似。从半导体方案中的电阻率数据推断出的两个能隙随压力增加到约7 GPA而增加,然后滴下液滴,与T_S的急剧抑制相吻合。这种行为与SMB6报告的行为相似,只是在T_S处突然下降之前,SMB6中的两个能隙会降低。 MFMMS测量值在FESI的T_S(19 K)处显示出鲜明的特征,但是对于SMB6,在T_S 4.5 K时未观察到此类特征。 SMB6缺乏T_S的功能可能是由于实验性问题引起的,并且将成为未来研究的主题。
Recently, evidence for a conducting surface state below 19 K was reported for the correlated d-electron small gap semiconductor FeSi. In the work reported herein, the conducting surface state and the bulk phase of FeSi were probed via electrical resistivity measurements as a function of temperature T, magnetic field B to 60 T and pressure P to 7.6 GPa, and by means of a magnetic field modulated microwave spectroscopy (MFMMS) technique. The properties of FeSi were also compared to those of the Kondo insulator SmB6 to address the question of whether FeSi is a d-electron analogue of an f-electron Kondo insulator and, in addition, a topological Kondo insulator. The overall behavior of the magnetoresistance MR of FeSi at temperatures above and below the onset temperature (T_S) 19 K of the conducting surface state is similar to that of SmB6. The two energy gaps, inferred from the resistivity data in the semiconducting regime, increase with pressure up to about 7 GPa, followed by a drop which coincides with a sharp suppression of T_S. This behavior is similar to that reported for SmB6, except that the two energy gaps in SmB6 decrease with pressure before dropping abruptly at T_S. The MFMMS measurements showed a sharp feature at T_S (19 K) for FeSi, but no such feature was observed at T_S 4.5 K for SmB6. The absence of a feature at T_S for SmB6 may be due to experimental issues and will be the subject of a future investigation.