论文标题
集成和包装
Integration and Packaging
论文作者
论文摘要
传感器和电子设备的垂直集成（3D）组合提供了制造小的，精细的螺距像素，总电容很小，总电容与复杂的电路完全集成在一起。小型电容是由3D混合键合的细像素螺距和低互连电容启用的，它提供了具有适度功率的出色信号/噪声。这种组合可以制造具有出色位置和时间分辨率的集成传感器和电子设备。在这份白皮书中，将讨论有关3D整合优势，高能量物理及其他地区的持续项目和前景的讨论。
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled by the fine pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. In this white paper a discussion will be presented on 3D integration advantages, ongoing projects and prospects in high energy physics and beyond.
