论文标题
多井反卷积的数学方面及其与电容抗性模型的关系
Mathematical aspects of Multiwell Deconvolution and its relation to Capacitance Resistance Model
论文作者
论文摘要
本文提供了对多韦尔反卷积（MDCV）和电容抗性模型（CRM）的数学方面的介绍以及它们之间的连接。两种方法都试图在表面流量和底部孔压力读数的长期历史上训练模型，然后预测底部孔和形成压力，以响应给定的产量/注射流量方案（称为“速率控制模拟”），或者可以预测对给定底部孔压力的响应的流量和形成压力（称为“压力控制模拟”）。已经表明，CRM可以被视为MDCV的部分情况，具有特定类型的缩减和跨孔压力瞬态响应，在实践中并不总是满足。本文还解释了这两种方法常见的局限性，并指定了MDCV可以处理的CRM的其他限制。
The paper provides introduction into the mathematical aspects of Multiwell Deconvolution (MDCV) and Capacitance Resistance Model (CRM) and connection between them. Both methods are trying to train a model over the long-term history of surface flowrates and bottomhole pressure readings and then predict bottomhole and formation pressure in response to a given production/injection flowrate scenario (called "rate control simulation") or alternatively may predict flowrate and formation pressure in response to a given bottomhole pressure scenario (called "pressure control simulation"). It has been shown that CRM can be viewed as a partial case of MDCV with a specific type of a drawdown and cross-well pressure transient responses which is not always met in practice. The paper also explains limitations which are common for both methods and specify additional limitations of CRM which MDCV can handle.
