论文标题
硅顶点和跟踪检测器研发
Silicon vertex and tracking detector R&D for CLIC
论文作者
论文摘要
物理学的目的是针对未来的高能线性$ e^+e^ - $ collider clic构成对检测器系统性能的挑战性要求。特别是，顶点和跟踪探测器必须结合几微米和低材料预算的空间分辨率，并具有几纳秒的时间stamp精度。对于顶点探测器，探索了基于焊料颠簸或各向异性导电膜的细节传感器，专用的65nm读数，精细的键合技术以及基于硅在启示剂技术的整体设备。对于大型表面CLIC跟踪器，正在研究具有大型和小收集电极的完全单片CMOS传感器。这项贡献概述了CLIC顶点和跟踪检测器研发，重点介绍了测试束运动和基于仿真的传感器优化研究的最新结果。
The physics aims at the proposed future high-energy linear $e^+e^-$ collider CLIC pose challenging demands on the performance of the detector system. In particular, the vertex and tracking detectors have to combine a spatial resolution of a few micrometres and a low material budget with a time-stamping accuracy of a few nanoseconds. For the vertex detector, fine-pitch sensors, dedicated 65nm readout ASICs, fine-pitch bonding techniques using solder bumps or anisotropic conductive films as well as monolithic devices based on Silicon-On-Insulator technology are explored. Fully monolithic CMOS sensors with large and small collection electrodes are under investigation for the large surface CLIC tracker. This contribution gives an overview of the CLIC vertex and tracking detector R&D, focusing on recent results from test-beam campaigns and simulation-based sensor optimisation studies.
