论文标题
带有分层半导体材料的低损失纳米电路电路
Low-loss integrated nanophotonic circuits with layered semiconductor materials
论文作者
论文摘要
具有直接带镜的单层过渡金属二分法是新兴的微电子,纳米光子学和光电子的候选者。这些半导体材料转移到光子综合电路(图片)上,使新的发光二极管,调制器和光电遗传器可以适合晶圆规模的制造。对于集成的光子设备,图片的光损耗至关重要。与硅硅(SI3N4)相反,已成为一个低损坏的平台,具有从紫外线到中红外的宽透明窗口,并且在电信带时没有两光子吸收。此外,由于其高的KERR非线性和高功率的手掌能,它适用于非线性集成光子学。 SI3N4的这些特征对纳米光学和光电应用程序本质上是有益的。在这里,我们报告了一个低损耗的集成平台,其中融合了单层甲虫丁硫硫醇(1L-MOTE2)和SI3N4光子微孔子。我们表明,通过1L-MOTE2,保持电信O波段到E波段的微孔子质量因子超过300万。我们进一步研究了由于存在1L-MOTE2而导致的微孔子分散剂和共振转移的变化,并推断了1L-Mote2在电信带中引入的光损耗,从激发型转换区域外。我们的工作提出了与分层半导体的低损失,混合图片的关键步骤,而无需使用异质的晶圆粘结。
Monolayer transition metal dichalcogenides with direct bandgaps are emerging candidates for microelectronics, nano-photonics, and optoelectronics. Transferred onto photonic integrated circuits (PICs), these semiconductor materials have enabled new classes of light-emitting diodes, modulators and photodetectors, that could be amenable to wafer-scale manufacturing. For integrated photonic devices, the optical losses of the PICs are critical. In contrast to silicon, silicon nitride (Si3N4) has emerged as a low-loss integrated platform with a wide transparency window from ultraviolet to mid-infrared and absence of two-photon absorption at telecommunication bands. Moreover, it is suitable for nonlinear integrated photonics due to its high Kerr nonlinearity and high-power handing capability. These features of Si3N4 are intrinsically beneficial for nanophotonics and optoelectronics applications. Here we report a low-loss integrated platform incorporating monolayer molybdenum ditelluride (1L-MoTe2) with Si3N4 photonic microresonators. We show that, with the 1L-MoTe2, microresonator quality factors exceeding 3 million in the telecommunication O-band to E-band are maintained. We further investigate the change of microresonator dispersion and resonance shift due to the presence of 1L-MoTe2, and extrapolate the optical loss introduced by 1L-MoTe2 in the telecommunication bands, out of the excitonic transition region. Our work presents a key step for low-loss, hybrid PICs with layered semiconductors without using heterogeneous wafer bonding.