论文标题
微纤维纤维耦合整体场单元中的纤维定位
Fiber positioning in microlens-fiber coupled integral field unit
论文作者
论文摘要
为Microlens纤维耦合的整体场单元提供了通用的纤维定位策略和制造路径。假定通过踏板索引,多模式光纤将微丝片生产的微图像携带到光谱仪输入中,但我们的结果也适用于微学生重新成像应用。考虑的是微图像与吞吐量和观察效率之间的纤维芯的填充百分比之间的性能交易。绩效功能定义为传输效率的乘积和Etendue损失的乘积。对于空间元件的六边形堆积,已经发现优异函数可将理想纤维IFU优异值的94%最大化,其具有Microlens纤维纤维对齐(中心)公差为1 UM RMS。通过光学建模分析了纤维和Microlens面之间的最大可接受的相对倾斜度,并且发现输入f比率比f/3.5慢的RMS是0.3度RMS,但对于更快的梁,它的放松得多。比较了制造纤维持有人的几种选择,以确定具有成本效益的解决方案,这些解决方案可提供所需的纤维定位精度。 femto秒激光钻孔方法在板上提供孔,其位置和直径精度为1.5 um rms,纵横比为1:10。商业供应商的厚度为5毫米,但定位准确性相似(1 UM RMS)。发现这两种技术都昂贵。在WCAM(威斯康星大学,麦迪逊大学的设施)进行的一种纯光刻板技术与深层反应离子蚀刻相结合,已用于生产具有100%产率的可重复配方。就孔定位和类似的直径精度(1 um rms)而言,光刻印更为精确(0.5 um rms)。
A generic fiber positioning strategy and a fabrication path are presented for microlens-fiber-coupled integral field units. It is assumed that microlens-produced micro-images are carried to the spectrograph input through step-index,multi-mode fiber, but our results apply to micro-pupil reimaging applications as well. Considered are the performance trades between the filling percentage of the fiber core with the micro-image versus throughput and observing efficiency.A merit function is defined as the product of the transmission efficiency and the etendue loss. For a hexagonal packing of spatial elements, the merit function has been found to be maximized to 94% of an ideal fiber IFU merit value (which has zero transmission loss and does not increase the etendue) with a microlens-fiber alignment (centering) tolerance of 1 um RMS. The maximum acceptable relative tilt between the fiber and the microlens face has been analyzed through optical modeling and found to be 0.3 degree RMS for input f-ratio slower than f/3.5 but it is much more relaxed for faster beams. Several options of fabricating fiber holders have been compared to identify cost-effective solutions that deliver the desired fiber positioning accuracy. Femto-second laser-drilling methods deliver holes arrayed on plates with a position and diameter accuracy of 1.5 um RMS, and with an aspect ratio of 1:10. A commercial vendor produces plates with thickness of 5 mm, but with similar (1 um RMS) positioning accuracy. Both of these techniques are found to be moderately expensive. A purely photo-lithographic technique performed at WCAM (a facility at the University of Wisconsin, Madison), in tandem with deep reactive ion etching, has been used to produce a repeatable recipe with 100% yield. Photo-lithography is more precise (0.5 um RMS) in terms of hole positioning and similar diameter accuracy (1 um RMS).