论文标题

hack3d:众包数字制造中的网络安全评估

HACK3D: Crowdsourcing the Assessment of Cybersecurity in Digital Manufacturing

论文作者

Linares, Michael, Aswani, Nishant, Mac, Gary, Jin, Chenglu, Chen, Fei, Gupta, Nikhil, Karri, Ramesh

论文摘要

数字制造(DM)网络物理系统容易受到网络和物理攻击的影响。 Hack3D是一系列由NYU网络安全中心主持的一系列众包红色团队,以评估使用DM嵌入的安全方法的强度。这项研究总结了Hack3D过去三种产品中学到的经验教训,包括熟练的工程师可以发起令人惊讶的攻击对DM设计的令人惊讶的攻击。一个关键结果是DM社区使用的DM安全基准的分类指导创建。

Digital manufacturing (DM) cyber-physical system is vulnerable to both cyber and physical attacks. HACK3D is a series of crowdsourcing red-team-blue-team events hosted by the NYU Center for Cybersecurity to assess the strength of the security methods embedded in designs using DM. This study summarizes the lessons learned from the past three offerings of HACK3D, including ingenious ways in which skilled engineers can launch surprising attacks on DM designs not anticipated before. A key outcome is a taxonomy-guided creation of DM security benchmarks for use by the DM community.

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