论文标题
石墨烯复合材料的高温电磁和热特性
High-Temperature Electromagnetic and Thermal Characteristics of Graphene Composites
论文作者
论文摘要
我们描述了一种可扩展的环氧复合材料与石墨烯和少层石墨烯填充剂的方法，并在高温下报告了此类复合材料的电磁干扰（EMI）屏蔽和热性能。经过测试的材料显示，在X波段频率范围为1 mm（〜2 mm）的厚度为1 mm（〜2 mm）的X波段频率范围为f = 8.2 GHz -12.4 GHz的厚度为1 mm（〜2 mm）。该复合材料的室温跨平面导热率与约19.5卷的填充剂为〜11.2 w/mk，这比原始环氧树脂大的X41倍数大于X41。有趣的是，随着温度升高到520 K，EMI屏蔽效率进一步提高，而导热率保持大致恒定。此类多功能石墨烯复合材料在升高温度下的出色EMI屏蔽和热传导特性对于微波组件的包装应用来说是有希望的，其中EMI屏蔽和热管理是重要的设计考虑因素。
We describe a method for scalable synthesis of epoxy composites with graphene and few-layer graphene fillers, and report on the electromagnetic interference (EMI) shielding and thermal properties of such composites at elevated temperatures. The tested materials reveal excellent total EMI shielding of ~65 dB (~105 dB) at a thickness of 1 mm(~2 mm) in the X-band frequency range of f=8.2 GHz - 12.4 GHz. The room-temperature cross-plane thermal conductivity of the composite with ~19.5 vol.% of fillers was determined to be ~11.2 W/mK, which is a factor of x41 larger than that of the pristine epoxy. Interestingly, the EMI shielding efficiency improves further as the temperature increases to 520 K while the thermal conductivity remains approximately constant. The excellent EMI shielding and heat conduction characteristics of such multifunctional graphene composites at elevated temperatures are promising for packaging applications of microwave components where EMI shielding and thermal management are important design considerations.
