论文标题
包装中毫米波：解决包装中的系统互连范式
Millimeter-wave in-package: tackling the system-in-package interconnection paradigm
论文作者
论文摘要
这项工作描述了高数据速率，节能毫米波（MM-WAVE）波导解决方案的体系结构和实现，以在集成电路（IC）软件包内集成。完整的波导溶液（与耦合器一起）已设计为适合晶圆粘合3D包装的紧密尺寸要求，并在MM波频谱中提供了极宽的带宽。为了实现这一目标，我们研究了新的高效率材料的使用。为了能够满足现代系统包装（SIP），单片微波集成电路（MMIC）和集成的高性能模拟IC以及数字信号处理（DSP）的数据率需求，我们的解决方案本质上可扩展且可在几种方面进行适应性。这项工作是新颖的，还讨论了与解决方案相关的各种机会和挑战。
This work describes the architecture and implementation of a high-data-rate, energy-efficient millimeter-wave (mm-wave) waveguide solution for integration inside an Integrated Circuit (IC) package. The complete waveguide solution (together with couplers) has been designed to fit into the tight dimensional requirements of a wafer bonded 3D package and provides an extremely wide bandwidth in the mm-wave spectrum. To achieve this, we investigate the use of new high-permittivity materials. To be able to fulfill the data-rate demands of modern System-in-Packages (SiPs), Monolithic Microwave Integrated Circuits(MMICs) and integrated high performance analog ICs together with Digital Signal Processing (DSP), our solution is inherently scalable and adaptable in several ways. The work is novel and also discusses the various opportunities and challenges associated with the solution.
