论文标题
CMS HGCAL升级的硅传感器：挑战，传感器设计和电气表征
Silicon sensors for the CMS HGCAL upgrade: Challenges, sensor design & electrical characterization
论文作者
论文摘要
The CMS detector will undergo significant improvements to face the 10-fold increase in integrated luminosity of LHC, the so-called High-Luminosity LHC, scheduled to start in 2027. This will include a completely new calorimeter in the CMS endcap regions, which should be able to withstand fluences of up to 10 16 n$_{eq}$ /cm$^2$ .新的高粒度量热仪（HGCAL）将具有前所未有的横向和纵向读数和触发分割，这将促进粒子流的方法重建电磁粒子阵雨及其能量。在低辐射区域中，HGCAL将配备小型塑料闪光灯瓷砖，作为活性材料与瓷砖硅光电层面相连。在较高的辐射区，由于其内在的辐射硬度，已选择硅。硅传感器将具有六角形形状，三个名义厚度为120μm，200μm和300μm，可针对不同辐射水平的区域进行了优化。它们将分为几百个单元格，其大小为0.5至1.1 cm $^2 $，每个单独读取。正在进行一项全面的活动，以融合最佳的传感器设计选择和参数，例如散装掺杂，布局和生产方法。全面传感器表征的结果是针对不同传感器的，以及大面积硅传感器的辐射运动的首先结果。
The CMS detector will undergo significant improvements to face the 10-fold increase in integrated luminosity of LHC, the so-called High-Luminosity LHC, scheduled to start in 2027. This will include a completely new calorimeter in the CMS endcap regions, which should be able to withstand fluences of up to 10 16 n$_{eq}$ /cm$^2$ . The new High Granularity Calorimeter (HGCAL) will have unprecedented transverse and longitudinal readout and trigger segmentation that will facilitate the particle-flow approach to reconstruct electromagnetic and hadronic particle showers and their energies. In regions of low radiation, HGCAL will be equipped with small plastic scintillator tiles as active material coupled to on-tile silicon photomultipliers. In the higher radiation zone, silicon has been chosen due to its intrinsic radiation hardness. The silicon sensors will be of hexagonal shape, with three nominal thicknesses of 120 μm, 200 μm and 300 μm, optimized for regions of different radiation levels. They will be segmented into several hundred cells with hexagonal shape of 0.5 to 1.1 cm$^2$ in size, each of which is read out individually. A comprehensive campaign is in progress to converge on optimal sensor design choices and parameters, such as bulk doping, layouts and production methods. Results from full electrical sensor characterization are presented for different sensors, together with first results from an irradiation campaign of large-area silicon sensors.
