论文标题
3D高阶拓扑绝缘子中的多维声音传播
Multidimensional sound propagation in 3D high-order topological sonic insulator
论文作者
论文摘要
高阶拓扑绝缘子（TIS）发展了常规的散装对应理论，并提高了搜索创新拓扑材料的兴趣。为了实现具有1D和2D传输模式的宽广泛带的高阶Ti，我们设计了非平凡和微不足道的3D声音晶体，其组合模仿了Su-Schrieffer-Heeger模型。高阶拓扑边界状态可以在界面上找到，包括0D角状态，1D铰链状态和2D表面状态。具有弯曲二维和一维声通道的制造样品在空间中表现出多维的声音传播，还验证了整体带隙内完整的带隙，铰链状态和表面状态之间的过渡。其中，单模铰链状态的带宽达到了较大的相对带宽9.1％，其中声音在一维中运输一维而没有明显的泄漏到表面或块状。研究中的高阶拓扑状态为空间中的多维声音操纵铺平了道路。
High-order topological insulators (TIs) develop the conventional bulk-boundary correspondence theory and rise the interest in searching innovative topological materials. To realize a high-order TI with a wide passband of 1D and 2D transportation modes, we design non-trivial and trivial 3D sonic crystals whose combination mimics the Su-Schrieffer-Heeger model. The high-order topological boundary states can be found at the interfaces, including 0D corner state, 1D hinge state, and 2D surface state. The fabricated sample with the bent two-dimensional and one-dimensional acoustic channels exhibits the multidimensional sound propagation in space, and also verifies the transition between the complete band gap, hinge states, and surface states within the bulk band gap. Among them, the bandwidth of the single-mode hinge state achieves a large relative bandwidth 9.1%, in which sound transports one-dimensionally without significant leak into the surfaces or the bulk. The high-order topological states in the study pave the way for multidimensional sound manipulation in space.
