论文标题
构造颗粒包装的配置使出色的热绝缘性能
Construct Particle-Packed Configuration Enable Excellent Thermal Insulation Performance
论文作者
论文摘要
纳米颗粒包装的床（NPB）作为一种有前途的热隔热材料，由于其热导率相当低（K）而广泛关注。在本文中，基于NPB形态使低K的概念，我们进一步提出了一种共同的方法，即一种混合策略，以进一步降低K并同时增强机械强度。杂化NPB的最低有效导热率（K_E）甚至可以低至0.018WM-1K-1，这远低于自由空气的K k，并且由于固体相导电导率（K_S）相当低，因此，由于固体体相传导率（K_S）相当低，因此可忽略不计的固体体相传导率（K_S），可忽略不计（k_a）和小型导电性（k_a）和小型导电性（k______）。忽略k_a，最小k_e发生在孔隙率从k_s变为k_r的孔隙率。此外，在二氧化硅杂交NPB中还收获了出色的机械强度，与散装二氧化硅相比，与散装二氧化硅相比将近40-50％。预计这项研究将为热绝缘材料设计提供一些信息。
The nanoparticle packed bed (NPB) as a kind of promising thermal insulation materials has drawn widely concern because of their quite low thermal conductivities (k). In this paper, based on the concept that NPB morphology enable low k, we further proposed a common method, a hybrid strategy, to further reduce k and enhance mechanical strength, simultaneously. The lowest effective thermal conductivity (k_e) of hybrid NPB can even as low as 0.018Wm-1K-1, which is much lower than the k of the free air and most common thermal insulation materials, due to the quite low solid-phase thermal conductivity (k_s), negligible thermal conductivity of the confined air (k_a) and small radiative thermal conductivity (k_r). Neglecting the k_a, the minimum k_e occurs at the porosity where domination role changes from k_s to k_r. In addition, an excellent mechanical strength, nearly 40-50 % compared to bulk silica, was also harvested in silica hybrid NPB. This study is expected to supply some information for thermal insulation material design.
