4746 NTERNATIONAL STANDARD ISO INTERNATIONAL ORGANIZATION FOR STANDARDIZATION MEKIYHAPOHHAI OPrAHH3ALIWS HIO CTAHIAPTH3ALIVIH.ORGANISATION INTERNATIONALE DE NORMALISATION Oxygen-free copper --- Scale adhesion test Cuivre exempt d'oxygene - Essai d'adherence de la pellicule d'oxyde First edition --- 1977-08-01 ISO 4746-1977 (E) UDC 661.856.22 : 539.216.2 : 539.536 Ref. No. ISO 4746-1977 (E) Price based on 1 page Copyright International Organization for Standardization Not for Resale FOREWORD IsO (the International Organization for Standardization) is a worldwide federation of national standards institutes (IsoO member bodies). The work of developing Internationa! Standards is carried out through ISO technical committees. Every member body interested in a subject for which a technical committee has been set up has the right to be represented on that committee. International organizations, governmentai and non-governmentai, in liaison with IsO, aiso take part in the work. Draft International Standards adopted by the technical committees are circulated to the member bodies for approval before their acceptance as International Standards by the IsO Council. International Standard ISO 4746 was developed by Technical Committee ISO/Tc 26, Copper and copper alloys, and was circulated to the member bodies in January 1976. It has been approved by the member bodies of the following countries : Belgium Korea, Dem. P. Rep. of Switzerland Brazil Mexico Turkey Chile Netherlands United Kingdom France Norway U.S.A. Hungary U.S.S.R. Portugal India Romania Yugoslavia Italy South Africa, Rep. of Japan Sweden No member body expressed disapproval of the document. Internationai Organization for Standardization, 1977 Printed in Switzerland Copyright International Organization for Standardization se fromIHS ISO 4746-1977 (E) INTERNATIONAL STANDARD Oxygen-free copper - Scale adhesion test 4 PREPARATION OFTESTPIECES 0 INTRODUCTION The scale adhesion test for copper provides a means of Any surface oxidation shall be removed completely assessing the suitability of oxygen-free copper primarily There shall be no surface discontinuity. Inclusions, particu- for use in electronic devicas, for applications involving iarly of copper(l) oxide, shall also be absent. The surface of glass-to-metal seals, or other uses relying on the formation the test piece should be similar to that produced by wet and presence of an adherent film of copper oxide. grinding with 400 grade silicon carbide. The test piece shall be degreased, cleaned by dipping in 10% (V/V) sulphuric acid in order to leave a bright 1 SCOPE AND FIELDOF APPLICATION clean surface, washed in cold tap water, rinsed in distilled This International Standard specifies a procedure for the water and dried after rinsing in alcohol or acetone. The test scale adhesion testing of oxygen-free high-conductivity piece shall not be touched by hand between the cleaning copper. and subsequent heating. 5 PROCEDURE 2 PRINCIPLE Heat the test piece, prepared in accordance with clause 4, in Preparation and heating in air of a test piece, followed by air at 850 to 875 °c for 30 min and immerse it immediately rapid cooling in water. Visual examination of the cooled in cold water. test piece for loss of the oxide film or blistering. 6 REQUIREMENTS 3 TEST PIECES The test piece, tested in accordance with clause 5, shall be visually examined. The black oxide film shall remain The test pieces shall be either of wire not less than 1 mm substantially unbroken and firmly adherent to the copper. diameter and not more than 2 mm diameter, or of wrought Slight loss of adherence at the edges of the test piece should flat strip of maximum cross-section 2 mm × 12 mm. be neglected. No blistering or loss of oxide film shall be Results from larger wrought or cast test pieces may be accepted if the degree of scale adhesion is satisfactory. apparent and the coloration shall be even. Copyright International Organization for Standardization sefromIHS